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BN/GS填充EP导热绝缘复合材料的制备
Preparation of BN/GS Filled EP Thermal Conductive and Electrical Insulation Composites

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郭玉兰 1,2,3   何静 1,2,3   屈琦琪 1,2,3   苏政 1,2,3   王化 1,3 *   田兴友 1,3  
文摘 采用化学还原法,利用氮化硼(BN)和氧化石墨烯(GO)制备了一种新型的具有三维网络结构的氮化硼/石墨烯(BN/GS)复合填料,并通过共混的方式制备了环氧树脂(EP)复合材料。运用包括高阻计及四探针测试系统等多种技术手段表征复合材料的结构和性能。研究结果表明,实验成功制备了具有三维网络结构的BN/GS复合填料,复合材料的热导率和热稳定性随着填料含量的增大而获得明显提升。由于GS在这种预制复合填料中的桥接作用,显著降低了界面热阻,BN/GS复合填料相比单一填料BN对复合材料热导率增加的效果更加突出,填料量达30wt%时,BN/GS/EP的热导率达到EP的热导率的5.38倍;由于GS含量低以及BN隔断GS之间的电子传输,复合材料仍保持良好的电绝缘性能。
其他语种文摘 BN/GS hybrid filler with three-dimensional network constructed was prepared by chemical reduction of boron nitride(BN)and graphene oxide(GO).Epoxy composites were obtained by physical mixing of the BN/GS hybrid filler and epoxy.Structures and properties of the composites were conventionally characterized using techniques including high resistivity meter and 4probe resistivity measuring system.The results first show that the preparation of the hybrid fillers with three dimensional network was successful. Thermal conductivity,thermal stability of the as-prepared composites enhance remarkably with increasing loading content of the fillers.The bridge effect of GS in the as-prepared hybrid filler reduces the interface thermal resistance significantly.Compared with BN filler,BN/GS hybrid filler is more effective in improving thermal conductivity of composites.Thermal conductivity of BN/GS/epoxy composite with 30wt% dosage is 5.38times as high as pure epoxy resin.As low content of BN and BN cut off the transmission of electrons of GS,the composites still have good electrical insulation performance.
来源 材料科学与工程学报 ,2020,38(2):189-193 【核心库】
DOI 10.14136/j.cnki.issn1673-2812.2020.02.003
关键词 氮化硼 ; 石墨烯 ; 三维结构 ; 导热性 ; 电绝缘性
地址

1. 中国科学院合肥物质科学研究院应用技术研究所, 安徽, 合肥, 230088  

2. 中国科学技术大学科学岛分院, 安徽, 合肥, 230026  

3. 中国科学院光伏和节能材料重点实验室, 中国科学院光伏和节能材料重点实验室, 安徽, 合肥, 230088

语种 中文
文献类型 研究性论文
ISSN 1673-2812
学科 一般工业技术
基金 国家重点研发资助项目 ;  中科院先导资助项目
文献收藏号 CSCD:6720729

参考文献 共 19 共1页

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引证文献 4

1 王金龙 填充型高导热绝缘复合材料的研究进展 化工新型材料,2021,49(6):21-24,28
CSCD被引 2

2 刘佩东 聚合物基电子封装材料的研究进展 工程塑料应用,2022,50(7):160-167
CSCD被引 3

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