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A novel Cu-bearing high-entropy alloy with significant antibacterial behavior against corrosive marine biofilms

Zhou Enze ^1,2 Qiao Dongxu ³ Yang Yi ^1,2 Xu Dake ^1,2 ^* Lu Yiping ³ ^* Wang Jianjun ² Smith Jessica A ⁴ Li Huabing ² Zhao Hongliang ⁵ Liaw Peter K ⁶ Wang Fuhui ^1,2

文摘	The design of novel high-entropy alloys(HEAs)provides a unique opportunity for the development of structure-function integrated materials with high mechanical and antimicrobial properties.In this study,by employing the antibacterial effect of copper,a novel Al_(0.4)CoCrCuFeNi HEA with broad-spectrum antibacterial and strong mechanical properties was designed.High concentrations of copper ions released from the HEA prevented growth and biofilm formation by biocorrosive marine bacterial species.These findings serve as a proof-of-concept for further development of unique HEA materials with high antimicrobial efficiency and mechanical properties,compared to conventional antibacterial alloys.
来源	Journal of Materials Science & Technology ,2020,46:201-210 【核心库】
DOI	10.1016/j.jmst.2020.01.039
关键词	High entropy alloys ; Biofilms ; Antibacterial property ; Mechanical properties
地址	1. Northeastern University, Shenyang National Laboratory for Materials Science, Shenyang, 110819 2. School of Materials Science and Engineering, Northeastern University, Key Laboratory for Anisotrotropy and Texture of Materials(Ministry of Education), Shenyang, 110819 3. School of Materials Science and Engineering, Dalian University of Technology, Key Laboratory of Solidification Control and Digital Preparation Technology(Liaoning Province), Dalian, 116024 4. Department of Biomolecular Sciences, Central Connecticut State University, USA, New Britain, 06050 5. School of Materials Science and Engineering, Zhengzhou University, Zhengzhou, 450001 6. Department of Materials Science and Engineering, The University of Tennessee, USA, Knoxville, TN37996
语种	英文
文献类型	研究性论文
ISSN	1005-0302
学科	金属学与金属工艺
基金	国家自然科学基金 ; the Fundamental Research Funds for the Central Universities ; Dalian Support Plan for Innovation of High-level Talents(Youth Technology Stars)
文献收藏号	CSCD:6758264

参考文献共 59 共3页

引证文献 39 篇

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