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Bi-Sn熔体在高熵合金上的润湿行为及界面特征
Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System

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马国峰 1   张鸿龄 1 *   孙俪娜 1   贺春林 1   张波 2   张海峰 3  
文摘 采用传统座滴法研究了低熔点合金(Bi-Sn)和高熵合金(AlCoFeNiCr和CuCoFeNiCr)之间的润湿行为及界面特征。借助扫描电子显微镜(SEM)和能谱分析(EDS)分析了Bi-Sn/AlCoFeNiCr和Bi-Sn/CuCoFeNiCr界面微观结构。结果表明:AlCoFeNiCr和CuCoFeNiCr高熵合金都是结构单一的固溶体,但Bi-Sn熔体在CuCoFeNiCr高熵合金基体上的润湿性明显地优于Bi-Sn熔体在AlCoFeNiCr高熵合金基体上的润湿性;Bi-Sn/CuCoFeNiCr界面发生剧烈的化学反应,有大量的界面反应物生成,Bi-Sn熔体中的原子Sn主要是沿着CuCoFeNiCr高熵合金中的富铜相扩散,而Bi-Sn/AlCoFeNiCr界面平直,且随着润湿温度的升高,Bi-Sn熔体中的原子向AlCoFeNiCr高熵合金基体的扩散程度加强并伴随化学反应,出现类似“皮下潜流”现象;由于CuCoFeNiCr高熵合金中富铜相的存在,为Bi-Sn在CuCoFeNiCr高熵合金基体上的铺展提供了“润湿通道”。
其他语种文摘 The wetting behavior and the interfacial characteristics of the molten Bi-Sn on the AlCoFeNiCr HEA (high entropy alloy) and the CuCoFeNiCr HEA substrate were investigated by a sessile drop method. Scanning electron microscopy (SEM) and energy dispersive X-ray spectrometry (EDS) were used to analyze the microstructure of the Bi-Sn/AlCoFeNiCr HEA and Bi-Sn/CuCoFeNiCr HEA interface. The results show that the AlCoFeNiCr HEA and the CuCoFeNiCr HEA form with a single solid solution structure. However, Bi-Sn molten alloy on CuCoFeNiCr HEA substrate has better wetting characteristics than Bi-Sn molten alloy on AlCoFeNiCr HEA substrate. With increasing wetting temperature, a number of intermetallic compounds are generated at the interface between the molten Bi-Sn and the CuCoFeNiCr HEA substrate, and the diffusion of Sn atom along the Cu-rich solid-solution phase in CuCoFeNiCr HEA is much more intense. On the contrary, the interface of the Bi-Sn/AlCoFeNiCr HEA system is still the straight interface, and there are new intermetallic compounds on the Bi-Sn/AlCoFeNiCr HEA interface with increasing wetting temperature. It is found that the Cu-rich phase in CuCoFeNiCrHEA provides a “wetting channel” for the wetting process between the molten Bi-Sn and CuCoFeNiCr HEA substrate, which result in the two wetting systems with different wetting mechanisms.
来源 稀有金属材料与工程 ,2018,47(8):2500-2505 【核心库】
关键词 高熵合金 ; Bi-Sn熔体 ; 润湿 ; 界面特征 ; 润湿机制
地址

1. 沈阳大学, 辽宁, 沈阳, 110044  

2. 沈阳航空大学, 辽宁, 沈阳, 110136  

3. 中国科学院金属研究所, 沈阳材料科学国家联合实验室, 辽宁, 沈阳, 110016

语种 中文
文献类型 研究性论文
ISSN 1002-185X
学科 金属学与金属工艺
基金 国家自然科学基金 ;  中国博士后科学基金 ;  辽宁省自然科学基金 ;  辽宁省教育厅项目 ;  开发基金
文献收藏号 CSCD:6316241

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引证文献 1

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