SnBi/Cu界面Bi偏聚机制与时效脆性抑制
查看参考文献27篇
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文摘
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长期时效的SnBi/Cu界面出现的Bi偏聚导致的界面脆性大大限制了Sn-58Bi低温无铅焊料的使用,因此有必要在理解其产生机制的基础上研究抑制界面Bi偏聚及时效脆性的方法.本文首先根据SnBi/Cu焊接界面在液态反应(回流焊接)和固态时效过程中的Bi偏聚行为讨论了偏聚形成的机制,而后阐述了Cu基体合金化和回流温度对Bi偏聚行为的影响,并讨论了合金化抑制Bi偏聚的微观机制.此外还比较了SnBi/Cu和SnBi/Cu-X焊接接头的拉伸、疲劳性能和断裂行为,证明了在消除界面Bi偏聚之后SnBi/Cu界面在拉伸和疲劳载荷下均不会出现脆性断裂,最后基于以上理解提出了消除界面脆性的新工艺方法. |
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来源
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中国科学. 技术科学
,2012,42(1):13-21 【核心库】
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DOI
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10.1360/ze2012-42-1-13
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关键词
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SnBi焊料
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Bi偏聚
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界面脆性
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基体合金化
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回流温度
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地址
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中国科学院金属研究所,材料疲劳与断裂研究部, 沈阳材料科学国家(联合)实验室, 沈阳, 110016
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语种
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中文 |
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文献类型
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综述型 |
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ISSN
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1674-7259 |
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学科
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化学 |
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基金
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国家973计划
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文献收藏号
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CSCD:4537645
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