界面接触热阻的研究进展
Development on thermal contact resistance
查看参考文献149篇
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文摘
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界面接触热阻(TCR)是电子器件冷却、低温超导薄膜等领域研究中的一个热点。综合评述了对接触热阻传热机理的研究方法、测量方法以及减小接触热阻的主要措施，介绍了近年来国内外对接触热阻的最新研究成果和进展，现有的研究表明:对于界面接触热阻这一特殊物理问题，其理论研究既要从宏观上定量分析又要在微观上综合考虑声子、电子的散射、辐射等机理;在实验方面，目前的测量精度不够高，实验测量工作有待进一步完善;在减小接触热阻方面，除了常用的方法外，可以通过在接触表面生长新型的高性能导热材料(碳纳米管等)来实现。对已报道的研究工作进行了总结，指出了今后的研究方向。 |
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其他语种文摘
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Thermal contact resistance(TCR)is a hot topic in electronics cooling,cryogenic superconducting thin films,etc.In this paper,the fundamental research method,metrology macro-and nanotechnology,and diminishing method for TCR are reviewed.In order to investigate the heat transfer mechanism of TCR,the scattering and radiation of phonon and electron should be considered besides the quantitative analysis in macro.For the experimental measurement,the accuracy is to be further improved.For reducing the contact resistance,in addition to the commonly used methods,producing new materials with high thermal conductivity(such as carbon nano-tubes)on the contact surface is a useful way.Based on the reported studies,the future researches are discussed. |
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来源
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化工学报
,2012,63(2):335-349 【核心库】
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DOI
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10.3969/j.issn.0438-1157.2012.02.001
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关键词
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接触热阻
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微纳米尺度传热
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电子散热
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接触热导
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地址
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南京理工大学能源与动力工程学院, 江苏, 南京, 210094
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语种
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中文 |
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文献类型
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综述型 |
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ISSN
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0438-1157 |
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文献收藏号
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CSCD:4435039
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参考文献 共
149
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