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Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al

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Xu B 1 *   Tong W P 1   Liu C Z 2   Zhang H 1   Zuo L 1   He J C 1  
文摘 The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid Al during reactive diffusion. It was found that the thickness of compound layer was reduced by the high magnetic field. The growth activation energy in β, γ_1 and ε_2 layers under a high magnetic field was larger than those in non magnetic circumstances, the increment percentage being 4.8%, 13.3% and 5.5%, respectively.
来源 Journal of Materials Science & Technology ,2011,27(9):856-860 【核心库】
DOI 10.1016/s1005-0302(11)60155-2
关键词 Diffusion ; Activation energy ; High magnetic field ; Al ; Cu
地址

1. Northeastern University, Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials, Shenyang, 110004  

2. Department of Materials Engineering, Shenyang Institute of Aeronautical Engineering, Shenyang, 110034

语种 英文
文献类型 研究性论文
ISSN 1005-0302
学科 金属学与金属工艺
基金 国家自然科学基金 ;  国家教育部高等学校学科创新引智计划项目 ;  国家教育部高等学校全国优秀博士学位论文作者专项资金 ;  国家教育部新世纪优秀人才支持计划 ;  the Fundamental Research Funds for the Central Universities
文献收藏号 CSCD:4410871

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