文摘
|
通过直接对Bi-Pb-Sn-Cd四元块状合金进行超声分散制备了相应的四元合金纳米微粒;采用X射线衍射仪和热分析仪分析所制备的纳米微粒结构;采用透射电子显微镜考察了纳米颗粒的形貌及尺寸分布;采用四球摩擦磨损试验机考察了纳米颗粒的摩擦学性能.结果表明,所制备的纳米颗粒为低熔点共晶合金纳米微粒,颗粒平均尺寸在10~20 nm之间,其作为润滑油添加剂表现出良好的摩擦学性能. |
其他语种文摘
|
Bi-Pb-Sn-Cd nanoalloy particles were prepared using sonochemical dispersion method. The morphology, size, and phase composition of the nanoparticles were analyzed by means of X-ray diffraction, differential thermal analysis and thermogravimetric analysis (DTA-TG), and transmission electron microscopy (TEM). The tribological properties of the nanoparticles as an additve in liquid paraffin were evaluated using a four-ball test rig, while the worn steel surface was observed using a scanning electron microscope. It was found that the as-prepared nanoalloy particles had good dispersing ability and composed of spherical crystallines with a size of 10~20 nm. The nanoparticles as the additive in liquid paraffin showed good friction-reducing and antiwear abilities and hence could be used as a good lubricating oil additive. |
来源
|
摩擦学学报
,2005,25(2):169-172 【核心库】
|
关键词
|
Bi-Pb-Sn-Cd四元合金
;
纳米微粒
;
超声分散
;
摩擦磨损性能
|
地址
|
1.
河南大学, 河南省省部共建特种功能材料教育部重点实验室, 河南, 开封, 475001
2.
河南大学, 特种功能材料重点实验室;;固体润滑国家重点实验室, 河南, 开封, 475001
|
语种
|
中文 |
ISSN
|
1004-0595 |
学科
|
化学;机械、仪表工业 |
基金
|
国家863计划
|
文献收藏号
|
CSCD:1925189
|
|
1.
周静芳. 油溶性铜纳米微粒作为液体石蜡添加剂的摩擦学性能研究.
摩擦学学报,2000,20(2):123-126
|
被引
45
次
|
|
|
|
2.
马剑奇. 油溶性Cu纳米微粒作为15W/40柴油机添加剂的摩擦学性能研究.
摩擦学学报,2004,24(2):134-138
|
被引
17
次
|
|
|
|
3.
许世红. 钼/全氟聚醚聚合薄膜的制备及摩擦学性能研究.
摩擦学学报,2003,23(6):468-471
|
被引
2
次
|
|
|
|
4.
孔晓丽. 铜表面纳米Cu-Zn复合层的摩擦磨损特性.
摩擦学学报,2003,23(4):276-281
|
被引
4
次
|
|
|
|
5.
Pol V G. Sonochemical depos-ition of air-stable iron nanoparticles on monodispersed carbon spherules[J].
Chem Mater,2003,15:1378-1384
|
被引
13
次
|
|
|
|
6.
Zhu J J. Sonochemical method for the preparation of monodisperse spherical and rectangular lead selenide nanoparticles[J].
Langmuir,2002,18:3306-3310
|
被引
11
次
|
|
|
|
7.
顾庆超. 新编化学用表(第一版)[M].
新编化学用表,1996
|
被引
1
次
|
|
|
|
8.
Kendall P W. Recent developments in current collection[J].
Physics in Technology,1975,6:117-126
|
被引
1
次
|
|
|