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高速光探测器封装的优化设计
Optimized Pack of High-Speed Photodiode
查看参考文献9篇
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文摘
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提出了一种高速光探测器封装优化设计的新方法。首先用矢量网络分析仪对封装寄生参量和探测器芯片进行准确测量，研究了探测芯片的本征参量与封装寄生参量之间的谐振现象，然后合理利用这种谐振效应对芯片的频率响应特性进行有效补偿。理论分析和实验结果都证明优化封装后器件的频率响应带宽超过了芯片的响应带宽。该方法不需要另加其它元件，而仅仅利用光电器件封装过程中必不可少的金丝所带来的寄生电感，就达到了改善器件频率响应特性的目的。 |
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其他语种文摘
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A novel optimization for packaging high-speed photodiodes is presented. All the packaging parasitics and the intrinsic characteristic parameters of the photodiode chip are accurately measured with microwave network analyzer. The resonance among them is investigated. The resonance is utilized to significantly improve the frequency response of the devices. Both theoretical and experimental results show that the packaged photodiodes can have a 3 dB bandwidth which is broader than that of the photodiode chip. This method, which utilizes the parasitic inductance of necessary bonding wires, can be used to improve the frequency response of optoelectronics devices without any additional component, only by using parasitic inductance induced by gold wire which is essential in packing process of optoelectronic devices. |
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来源
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光学学报
,2004,24(5):659-662 【核心库】
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关键词
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高速光探测器
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封装设计
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寄生参量
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频率响
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地址
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中国科学院半导体研究所, 集成光电子学国家重点实验室, 北京, 100083
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语种
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中文 |
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文献类型
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研究性论文 |
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ISSN
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0253-2239 |
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学科
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物理学 |
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基金
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国家863计划
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国家973计划
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国家自然科学基金国家杰出青年科学基金
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文献收藏号
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CSCD:1696335
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参考文献 共
9
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