Bi-Sn熔体在高熵合金上的润湿行为及界面特征
Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System
查看参考文献20篇
文摘
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采用传统座滴法研究了低熔点合金(Bi-Sn)和高熵合金(AlCoFeNiCr和CuCoFeNiCr)之间的润湿行为及界面特征。借助扫描电子显微镜(SEM)和能谱分析(EDS)分析了Bi-Sn/AlCoFeNiCr和Bi-Sn/CuCoFeNiCr界面微观结构。结果表明:AlCoFeNiCr和CuCoFeNiCr高熵合金都是结构单一的固溶体,但Bi-Sn熔体在CuCoFeNiCr高熵合金基体上的润湿性明显地优于Bi-Sn熔体在AlCoFeNiCr高熵合金基体上的润湿性;Bi-Sn/CuCoFeNiCr界面发生剧烈的化学反应,有大量的界面反应物生成,Bi-Sn熔体中的原子Sn主要是沿着CuCoFeNiCr高熵合金中的富铜相扩散,而Bi-Sn/AlCoFeNiCr界面平直,且随着润湿温度的升高,Bi-Sn熔体中的原子向AlCoFeNiCr高熵合金基体的扩散程度加强并伴随化学反应,出现类似“皮下潜流”现象;由于CuCoFeNiCr高熵合金中富铜相的存在,为Bi-Sn在CuCoFeNiCr高熵合金基体上的铺展提供了“润湿通道”。 |
其他语种文摘
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The wetting behavior and the interfacial characteristics of the molten Bi-Sn on the AlCoFeNiCr HEA (high entropy alloy) and the CuCoFeNiCr HEA substrate were investigated by a sessile drop method. Scanning electron microscopy (SEM) and energy dispersive X-ray spectrometry (EDS) were used to analyze the microstructure of the Bi-Sn/AlCoFeNiCr HEA and Bi-Sn/CuCoFeNiCr HEA interface. The results show that the AlCoFeNiCr HEA and the CuCoFeNiCr HEA form with a single solid solution structure. However, Bi-Sn molten alloy on CuCoFeNiCr HEA substrate has better wetting characteristics than Bi-Sn molten alloy on AlCoFeNiCr HEA substrate. With increasing wetting temperature, a number of intermetallic compounds are generated at the interface between the molten Bi-Sn and the CuCoFeNiCr HEA substrate, and the diffusion of Sn atom along the Cu-rich solid-solution phase in CuCoFeNiCr HEA is much more intense. On the contrary, the interface of the Bi-Sn/AlCoFeNiCr HEA system is still the straight interface, and there are new intermetallic compounds on the Bi-Sn/AlCoFeNiCr HEA interface with increasing wetting temperature. It is found that the Cu-rich phase in CuCoFeNiCrHEA provides a “wetting channel” for the wetting process between the molten Bi-Sn and CuCoFeNiCr HEA substrate, which result in the two wetting systems with different wetting mechanisms. |
来源
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稀有金属材料与工程
,2018,47(8):2500-2505 【核心库】
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关键词
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高熵合金
;
Bi-Sn熔体
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润湿
;
界面特征
;
润湿机制
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地址
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1.
沈阳大学, 辽宁, 沈阳, 110044
2.
沈阳航空大学, 辽宁, 沈阳, 110136
3.
中国科学院金属研究所, 沈阳材料科学国家联合实验室, 辽宁, 沈阳, 110016
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语种
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中文 |
文献类型
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研究性论文 |
ISSN
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1002-185X |
学科
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金属学与金属工艺 |
基金
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国家自然科学基金
;
中国博士后科学基金
;
辽宁省自然科学基金
;
辽宁省教育厅项目
;
开发基金
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文献收藏号
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CSCD:6316241
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参考文献 共
20
共1页
|
1.
Wang Z W.
Acta Mater,2017,126:346
|
CSCD被引
23
次
|
|
|
|
2.
Stepanov N D.
Mater Lett,2016,185:1
|
CSCD被引
11
次
|
|
|
|
3.
Liu X T.
Rare Mater Materials and Engineering,2016,45(9):2201
|
CSCD被引
1
次
|
|
|
|
4.
Liu B.
Intermetallics,2016,75:25
|
CSCD被引
19
次
|
|
|
|
5.
Ye Q F.
Applied Surface Science,2017,396:1420
|
CSCD被引
42
次
|
|
|
|
6.
Tsai K Y.
Acta Materialia,2013,61(13):4887
|
CSCD被引
164
次
|
|
|
|
7.
Wang R.
Journal of Alloys and Compounds,2017,694:971
|
CSCD被引
24
次
|
|
|
|
8.
Chuang M H.
Acta Materialia,2011,59(16):6308
|
CSCD被引
179
次
|
|
|
|
9.
Salemi F.
Journal of Alloys and Compounds,2016,685:278
|
CSCD被引
3
次
|
|
|
|
10.
Liashenko O Y.
Scripta Materialia,2017,127:24
|
CSCD被引
3
次
|
|
|
|
11.
Ma G F.
Journal of Alloys and Compounds,2017,690:903
|
CSCD被引
1
次
|
|
|
|
12.
Niu X.
Journal of Alloys and Compounds,2015,646:852
|
CSCD被引
2
次
|
|
|
|
13.
Otto F.
Acta Mater,2013,61(7):2628
|
CSCD被引
83
次
|
|
|
|
14.
Shahmir H.
Materials Science and Engineering A,2016,676:294
|
CSCD被引
25
次
|
|
|
|
15.
Qiu X W.
Journal of Alloys and Compounds,2013,555:246
|
CSCD被引
14
次
|
|
|
|
16.
Gale W F.
Journal of Materials Science,1997,32(18):4931
|
CSCD被引
4
次
|
|
|
|
17.
Okamoto I.
Transaction of JWR,1980,9:19
|
CSCD被引
1
次
|
|
|
|
18.
Shen Y.
Materials Science and Technology,2001,17(10):1293
|
CSCD被引
2
次
|
|
|
|
19.
Ma G F.
Applied Surface Science,2015,356:460
|
CSCD被引
4
次
|
|
|
|
20.
Aksay I A.
Journal of Physical Chemistry,1974,78:1178
|
CSCD被引
19
次
|
|
|
|
|