SnBi/Cu界面Bi偏聚机制与时效脆性抑制
查看参考文献27篇
|
文摘
|
长期时效的SnBi/Cu界面出现的Bi偏聚导致的界面脆性大大限制了Sn-58Bi低温无铅焊料的使用,因此有必要在理解其产生机制的基础上研究抑制界面Bi偏聚及时效脆性的方法.本文首先根据SnBi/Cu焊接界面在液态反应(回流焊接)和固态时效过程中的Bi偏聚行为讨论了偏聚形成的机制,而后阐述了Cu基体合金化和回流温度对Bi偏聚行为的影响,并讨论了合金化抑制Bi偏聚的微观机制.此外还比较了SnBi/Cu和SnBi/Cu-X焊接接头的拉伸、疲劳性能和断裂行为,证明了在消除界面Bi偏聚之后SnBi/Cu界面在拉伸和疲劳载荷下均不会出现脆性断裂,最后基于以上理解提出了消除界面脆性的新工艺方法. |
|
来源
|
中国科学. 技术科学
,2012,42(1):13-21 【核心库】
|
|
DOI
|
10.1360/ze2012-42-1-13
|
|
关键词
|
SnBi焊料
;
Bi偏聚
;
界面脆性
;
基体合金化
;
回流温度
|
|
地址
|
中国科学院金属研究所,材料疲劳与断裂研究部, 沈阳材料科学国家(联合)实验室, 沈阳, 110016
|
|
语种
|
中文 |
|
文献类型
|
综述型 |
|
ISSN
|
1674-7259 |
|
学科
|
化学 |
|
基金
|
国家973计划
|
|
文献收藏号
|
CSCD:4537645
|
参考文献 共
27
共2页
|
|
1.
Smernos S. Low-temperature soldering.
Elect Commun,1982,57:148-151
|
CSCD被引
1
次
|
|
|
|
|
2.
Abtew M. Lead-free solders in microelectronics.
Mater Sci Eng R,2000,27:95-141
|
CSCD被引
121
次
|
|
|
|
|
3.
Mei Z. Characterization of eutectic Sn–Bi solder joints.
J Electron Mater,1992,21:599-607
|
CSCD被引
7
次
|
|
|
|
|
4.
Glazer J. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review.
J Electron Mater,1994,23:693-700
|
CSCD被引
8
次
|
|
|
|
|
5.
Kang S K. Lead (Pb)-free solder for electronic packaging.
J Electron Mater,1994,23:701-707
|
CSCD被引
15
次
|
|
|
|
|
6.
Pang X Y. Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities.
J Electron Mater,2010,39:1277-1282
|
CSCD被引
2
次
|
|
|
|
|
7.
Liu P L. Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect.
Scr Mater,2001,44:1019-1023
|
CSCD被引
6
次
|
|
|
|
|
8.
Zou H F. Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate.
Scr Mater,2009,61:308-311
|
CSCD被引
5
次
|
|
|
|
|
9.
Liu P L. Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect.
J Mater Res,2001,16:1651-1659
|
CSCD被引
5
次
|
|
|
|
|
10.
Zhu Q S. Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film.
J Mater Res,2008,23:78-82
|
CSCD被引
2
次
|
|
|
|
|
11.
Zou H F. Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature.
J Mater Res,2011,26:449-454
|
CSCD被引
2
次
|
|
|
|
|
12.
Shang P J. Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints.
Scr Mater,2008,58:409-412
|
CSCD被引
5
次
|
|
|
|
|
13.
Laurila T. Interfacial reactions between lead-free solders and common base materials.
Mater Sci Eng R,2005,49:1-60
|
CSCD被引
54
次
|
|
|
|
|
14.
Larsson A K. The superstructure of domain-twinned ETA'-Cu_6Sn_5.
Acta Cryst B,1994,50:636-643
|
CSCD被引
3
次
|
|
|
|
|
15.
Kao C. Microstructures developed in solid-liquid reactions: Using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples.
Mater Sci Eng A,1997,238:196-201
|
CSCD被引
1
次
|
|
|
|
|
16.
Suh M S. Growth kinetics of Cu-Sn intermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints.
Mater Chem Phys,2008,110:95-99
|
CSCD被引
3
次
|
|
|
|
|
17.
Tu K N. Kinetics of interfacial reaction in bimetallic Cu-Sn thin-films.
Acta Metall,1982,30:947-952
|
CSCD被引
20
次
|
|
|
|
|
18.
Laurila T. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering.
Mater Sci Eng R,2010,68:1-38
|
CSCD被引
18
次
|
|
|
|
|
19.
Laurila T. Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers.
Microelectron Reliab,2009,49:242-247
|
CSCD被引
7
次
|
|
|
|
|
20.
Hultgren R.
Selected Values of Thermodynamic Properties of Binary Alloys,1973
|
CSCD被引
5
次
|
|
|
|
|
了解气象卫星更多信息，请访问