Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
查看参考文献24篇
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文摘
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The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. |
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来源
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Journal of Materials Science & Technology
,2011,27(8):741-745 【核心库】
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DOI
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10.1016/s1005-0302(11)60136-9
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关键词
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Solder
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Interfacial reaction
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Intermetallics
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Kinetics
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地址
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1.
Northeastern University, Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Shenyang, 110004
2.
Shenyang Aerospace University, Shenyang, 110136
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语种
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英文 |
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文献类型
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研究性论文 |
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ISSN
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1005-0302 |
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学科
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金属学与金属工艺 |
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基金
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国家自然科学基金
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国家教育部高等学校学科创新引智计划项目
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国家教育部高等学校全国优秀博士学位论文作者专项资金
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国家教育部新世纪优秀人才支持计划
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the Fundamental Research Funds for the Central Universities
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文献收藏号
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CSCD:4410852
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