薄膜微区域变形的微标记阵列检测方法研究
Microregion Deformation Measurement of Thin Films Using Array Microindentation Mark Method
查看参考文献12篇
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文摘
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本文应用阵列微压痕标记技术完成了薄膜表面微孔洞缺陷邻域变形检测.检测中通过应用纳米压痕和微区域放电技术,制作微标记阵列和微孔洞缺陷,并在数字化显微系统下完成微区域点阵变形检测,进而实现微区域小变形测量.研究了微标记点的信息提取与表征方法,讨论了微标记法在薄膜材料性能检测中的可行性及其检测性能. |
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其他语种文摘
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The measurement of deformation in microregion or on a microcomponent always faces two problems. One is the rigid displacement caused by the unitary motion of the specimen, and the other the rather small deformation in the microregion. Therefore, it is quite necessary to find a suitable way to determine the microregion deformations and mechanical properties. In this paper, the deformation in the vicinity of a microcavity defect on the film surface is measured by the proposed array microindentation mark method. The array microindentation marks are indented using a nanoindentation machine and the microcavity defect is produced by the electrical discharge machining (EDM) technique. Moreover, deformations in the microregion are measured under a digital microscopic system. Further, the microregion deformation extracting method, the feasibility and the measuring performance of the array microindentation mark method are also discussed. |
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来源
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光子学报
,2005,34(5):737-741 【核心库】
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关键词
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薄膜
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微区域变形
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微压痕
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标记法
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微缺陷
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地址
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1.
清华大学工程力学系, 北京, 100084
2.
中国科学院力学研究所, 非线性力学国家重点实验室, 北京, 100080
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语种
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中文 |
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文献类型
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研究性论文 |
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ISSN
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1004-4213 |
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学科
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物理学 |
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基金
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国家自然科学基金
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国家973计划
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清华大学开放基金
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文献收藏号
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CSCD:2028241
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