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文摘
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研制微力学测试仪,对微电子机械系统中键合结构的强度进行测试.最大载荷为1.4 N,在载荷量程为450 mN时仪器的最高分辨力为10 μN.采用键合在玻璃基底上的硅悬臂梁作为试样.为模拟横力剪切破坏和扭转破坏工况,用微力学测试仪分别在悬臂梁的固定端和自由端施加载荷至试样破坏.测得相应的破坏载荷并计算出最大剪应力.对破坏残骸的显微观察发现,存在玻璃开裂和硅开裂2种失效模式.该技术为微电子机械系统(micro-electro-mechanical system,MEMS)键合结构的强度表征提供一种有效方法,并可用来进行微悬臂梁或微桥的强度测试. |
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其他语种文摘
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An inslniment named Sujier Micra-T?slw (SMT) has been designed for testing the bonding strength of anchors. 'Ilic maximum load rapacity of SMT is 1.4 N, and the minimum resolution is 10 /tN at a range of 450 mN. Silicon micro-cantilever specimens with one mil anchored on p;lass wen- (khricaled for this test. In order to simulate shear failure and torsion failure, SMT applied a force through a probe to push micro-cantilevers at the fixed-end and free-end respectively until they failed. The correspond ing critical loads were recorded for calculating the bonding strength of different specimens. A microscope was set in front of the specimen to capture the whole te.sl process. The rupture occurs in glass or silicon respectively for different samples. This novel technique provides an effective so-lution for delermining bonding strength in MEMS (micro-electro-mechanical system) devices, and it also can be used to evaluate the strength of micro-cantilevers or micro-bridges |
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来源
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机械强度
,2005,27(3):331-334 【扩展库】
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关键词
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微电子机械系统
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键合
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微悬臂梁
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强度
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地址
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1.
中国科学院力学研究所, 非线性力学国家重点实验室, 北京, 100080
2.
北京大学微电子学系MEMS工艺研究室, 北京, 100871
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语种
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中文 |
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文献类型
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研究性论文 |
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ISSN
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1001-9669 |
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学科
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力学 |
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基金
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国家自然科学基金项目
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中国科学院知识创新工程项目
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国家973计划
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国家高技术研究发展计划
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文献收藏号
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CSCD:1989588
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